THE FOOD PACKAGING HACKATHON

UNPACK YOUR CREATIVITY

October 18-19, JVP Campus, Jerusalem

 

FOOD PACKAGING

It's everywhere but goes unnoticed by most people. This is where you come in.

The packaging world is undergoing massive changes.

 

From materials to user experience, science and design is revolutionizing the industry and the world’s biggest food giants are constantly looking for innovation. The HACKPACK Hackathon is a 24-hour sprint to innovate on the hot topic of the food industry - packages.

 

Do you think you have the total package? Use your skills to fight food loss, one package at a time.

משרד הכלכלה והתעשייה
יוזמה לאומת בהובלת אראל מרגלית
Fooctech Israel Community קהילת פודטק ישראל
הפקולטה לחקלאות מזון וסביבה
המכון הישראלי לאריזה
Facultech פקולטק
Fooctech Israel Community קהילת פודטק ישראל
יוזמה לאומת בהובלת אראל מרגלית
משרד הכלכלה והתעשייה
 

THE CHALLENGES

FOOD QUALITY

Think inside the box

CONSUMER EXPERIENCE

Innovate on usability and efficiency

SUSTAINABILITY

From recyclable to degradable

 

WELCOME TO PARTICIPATE

MATERIALS TRACK
USAGE TRACK

MENTORS

Liora Rosin

Product Designer & Lecturer, Industrial Design Department, Bezalel Academy of Arts and Design, Jerusalem 

Dr. Tammy Meiron

BioTech & FoodTech Executive Consultant Lecturer, Biochemistry and Food Science, HUJI

Baruch Naeh

Creative Director,

Baruch Naeh Strategic Brand Design

Dov Ganchrow

Product Designer & Senior Lecturer, Industrial Design Department, Bezalel Academy of Arts and Design, Jerusalem

Dr. Yohanan Aravot

Food, Packaging & Agriculture Consultant Lecturer, Biochemistry and Food Science, HUJI

Dr. Dikla Montekio

Associate,

GreenSoil Investments

Maya Schushan Orgad

VP Trendlines Agtech,

the Bayer-Trendlines AG Innovation fund

Trendlines

Dr. Ron Porat

Researcher at the Institute of Postharvest and Food Science, ARO, the Volcani Center

FAQ

When and where is the hackathon?

October 18-19, JVP Campus, Jerusalem.

What is the professional background requirement?

We’re mainly looking for scientists, engineers, students and entrepreneurs in relevant fields: Plastics, chemistry, biology, mechanics and materials; Alongside: Developers, industrial designers and makers. But any individual related to the challenges can apply.

READ MORE >>

 

ABOUT HackPack

Come join us this October as we combine forces to reduce food loss and waste by changing how food is packed. Just in time for FAO World Food Day 2018, we invite food technologists, chemists, physicists, biologists, artists and product designers, economists, high school and undergrad students, engineers and the creative general public, to participate in the first food packaging hackathon at the JVP Campus, Jerusalem. Together we will tackle one of the most challenging and impactful aspects of keeping the world fed and clean, in two intense days of originality and innovation.

READ MORE >>

 
 

FROM THE MEDIA

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CONTACT

האקתון אריזות המזון מתקיים בהובלת קהילת פודטק ישראל; הפקולטה לחקלאות, מזון וסביבה ברחובות; המכון הישראלי לאריזה; בצלאל; ויתקיים בחודש אוקטובר הקרוב בפקולטה ברחובות. 

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